Monolithic three-dimensional integration of silicon transistors

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Monolithic three-dimensional integration of silicon transistors

Build it up. Nat. Electron . 7 , 415 (2024). Narayanan, V. Going vertical: the future of electronics. IEEE Micro 39 , 6–7 (2019). Article Google Scholar Datta, S. et al. …

Build it up. Nat. Electron . 7 , 415 (2024). Narayanan, V. Going vertical: the future of electronics. IEEE Micro 39 , 6–7 (2019). Article Google Scholar Datta, S. et al. Back-end-of-line compatible transistors for monolithic 3-D integration. IEEE Micro 39 , 8–15 (2019). Article Google Scholar Bishop, M. D., Wong, H. -S. P., Mitra, S. & Shulaker, M. M. Monolithic 3-D integration. IEEE Micro 39 , 16–27 (2019). Article Google Scholar Jayachandran, D., Sakib, N. U. & Das, S. 3D integration of 2D electronics. Nat. Rev. Electr. Eng. 1 , 300–316 (2024). Article Google Scholar Vianello, E. & Payvand, M. Scaling neuromorphic systems with 3D technologies. Nat. Electron. 7 , 419–421 (2024). Article Google Scholar Sheikh, F., Nagisetty, R., Karnik, T. & Kehlet, D. 2.5D and 3D heterogeneous integration: emerging applications. IEEE Solid-State Circuits Mag. 13 , 77–87 (2021). Article Google Scholar Bourjot, E. et al. Towards 5 μm interconnection pitch with die-to-wafer direct hybrid bonding. In Proc. 71st Electronic Components and Technology Conference (ECTC), 470–475 (IEEE, 2021). Dhananjay, K., Shukla, P., Pavlidis, V. F., Coskun, A. & Salman, E. Monolithic 3D integrated circuits: recent trends and future prospects. IEEE Trans. Circuits Syst. II Express Briefs 68 , 837–843 (2021). Google Scholar Chang, S. W. et al. First demonstration of CMOS inverter and 6T-SRAM based on GAA CFETs structure for 3D-IC applications. In Proc. …

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